EchoStar has an exciting opportunity for a Mechanical Engineering Lead in our Hughes Network Systems division f or the research and development of cutting-edge satellite communication equipment & systems. The candidate will be responsible for engineering mechanical solutions to electronic packaging challenges at the chip level, board level, enclosure level, and Data Center level. Custom indoor and outdoor enclosure design & development will be a major area of focus, protecting custom circuit board designs from harsh environments. This position is in our Germantown, MD location.

Responsibilities:

This person will participate in the full product life cycle from Concept Industrial Design, Analysis, CAD Development, Prototyping, Testing, Production Release, and ongoing Production Support. Must work well with multi-disciplined engineering teams, including Digital EE's, RF EE's, & MFGR Engr's. Expected to conduct design reviews and be accountable for meeting cost goals & schedule milestones. May be responsible for the technical direction and mentoring of junior mechanical engineers.

Requirements:

• BSME (or MSME) in Mechanical Engineering.
• 10+ years of experience in Telecommunications Electronic Packaging.
• 5+ years using 3D CAD System CREO.
• 5+ years of broad material design for high volume fabrication techniques (including plastics, die castings, extrusions, sheet metal, & elastomers).

Preferred Qualifications:

• Experience performing Thermal Analysis & Structural Analysis.
• Knowledge with environmental test standards MIL-STD-810 & DO-160.
• Technical awareness of UL safety standards, EMI/EMC standards, and design techniques to achieve compliance.
• Familiarity with DFMA & DFMEA.
• Project lead & Project management experience.
• Well spoken, self starter, with high energy level & motivation to succeed.

Will be eligible for discretionary bonus, with funding based on company performance.