40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m. MINIMUM REQUIREMENTS: Must have a Bachelors degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 3 years of engineering experience. Alternatively, will accept a Masters degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 1 year of engineering experience. Must have 1 year of experience with semiconductor process engineering. Must have 1 year of experience in at least 2 of the following: Design of Experiment (DOE); statistical process control; or statistical methods for modeling multivariate data sets. Must have 1 year of experience in at least 2 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR). Must have 1 year of experience in at least 3 of the following: wafer cross section techniques; wafer fabrication processes; ion transport phenomena; dynamic random-access memory (DRAM); plasma etching; plasma simulation; semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash; Chemical Vapor Deposition (CVD); or Plasma Enhanced Chemical Vapor Deposition (PECVD). Please email resume to and reference Job .