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Senior Mechanical Engineer (Electronics Packaging)


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Job ID:

423849

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Pine Brook, NJ, United States 
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Job Views:

18

Posted:

05.11.2025
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Job Description:

Opportunity Details
Contract to Direct Senior Mechanical Engineer (Electronics Packaging)
Pine Brook, NJ
Senior Mechanical Engineer (Electronics Packaging)
Location: Pine Brook, NJ
Pay: $65 - $85/hr depending on experience
Type: Contract to Direct
NOTE: Enser is an Engineering Services Company that provides Staffing Support. This position is not internal to Enser. Please No Agencies.
Position Summary:
The The Senior Engineer is responsible to complete and contribute to the design, development, testing, qualification, and production support of products in a cost effective and timely fashion to meet the customer's needs and schedules. The engineer shall work within a multi-disciplined organization and enlist the help of other disciplines when necessary, such as other engineers, manufacturing, purchasing, and quality assurance. Occasional light travel may be involved.
Key Responsibilities:
  • Design and development of ruggedized electronics and electronics enclosures from a blank sheet of paper to meet customer requirements through all phases of product life cycle. Typical tasks include:
    • Preliminary CAD design of electronics / electronics enclosures
    • Interface with electrical engineers to establish sizing of circuit card assemblies and selection of materials.
    • Ensure accuracy of all relevant drawings/documents on the project, except purely drafting technique issues. This includes tolerance stack-ups.
    • Coordinate the creation of a preliminary bill of material in the business system and verifying its accuracy.
    • Perform, or coordinate and review, preliminary analytical results (Hand calcs and/or FEA)
    • Communicate technical and schedule problems, in a timely manner, to Engineering Manager / Director, Contracts Administrator, and Program Manager when applicable.
    • Disposition non-conforming hardware and assist with correcting production/vendor issues.
    • Lead / Participate in failure investigations of designs as required.
    • Create/Review and Approve processes for assembly, test, and related activities to the development and qualification testing of a design.
    • Interface with internal and external customers to determine product changes needed for applications as a representative of the company.
    • Write technical documents for internal and external customers.
    • Participate in design reviews (internal and external)
  • Support new business pursuits that address program technical requirements and associated schedule and costs.
  • Mentor and Guide Junior team members.
Qualifications:
  • B.S. in Mechanical Engineering is required (Advanced technical degree desirable).
  • 5+ years design experience and technical knowledge in mechanical engineering design of electronics packaging preferably in aerospace or defense industry.
  • Ability to solve complex mechanical static & dynamic problems.
  • Works precisely, accurately, and pays close attention to all details.
  • High level of mechanical aptitude and knowledge.
  • Experience in 3D CAD solid modeling and understanding of mechanical design principle (Experience with PTC CREO desirable)
  • Excellent verbal/written communication skills required for multi-faceted interactions with all levels of personnel within the organization, as well as all outside agents, including but not limited to, vendors, suppliers, customers, potential job candidates, etc.
  • Highly computer literate, with MS Office/PC expertise, and demonstrated experience with applicable systems, programs, equipment, etc.
  • Design experience with electronic packaging approaches for defense and aerospace applications including:
    • Design for high shock and high vibration environments.
    • Design for challenging thermal conditions.
    • Innovative techniques for cooling electronics in a high-temperature environment (e.g. phase-change approaches).
    • Knowledge of IPC, WHMA, and NASA specifications for Printed Wiring Boards (PWBs), Circuit Card Assemblies (CCAs), wiring harnesses, and soldering.
    • Knowledge of high voltage / altitude design practices at the board and box-level.
    • Experience designing and testing designs to Mil-Std-810 Environments or similar (Humidity, Salt Fog, Vibration and Shock etc.)
  • Experience with design for manufacturability.
    • Knowledge of machining operations, brazing, and additive manufacturing.
    • Knowledge of PWB and CCA fabrication
  • Ability to prioritize and manage multiple tasks simultaneously.
  • Experience performing analytical solutions to structural and thermal design problems using closed-form, ANSYS, ABAQUS, and/or CREO Simulate.
  • Must be a US Citizen
Other Information:
  • Position entails exposure to typical manufacturing (i.e. Machine Shop, Assembly, Testing, etc.) environments inclusive of the appropriate eye, hearing and foot protection (as required).
  • Business office environment requiring use of telephone and personal computer.
  • Work under pressure and overtime when required, in order to meet deadlines.