Lithography Process Engineer (Multiple Positions)

40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m. MINIMUM REQUIREMENTS: Must have a Masters degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field. Must have education or experience in at least 2 of the following: Design of Experiment (DOE); semiconductor fabrication; statistical process control; or statistical methods for modeling multivariate data sets. Must have education or experience in at least 3 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR). Must have education or experience in at least 3 of the following semiconductor photolithography tools or processes: N4 and N5 IC manufacturing process; DUV Photolithography 193nm and 248nm (ASML Twinscan Scanners); 193nm immersion multiple patterning processes including litho-etch-litho-etch (LELE) and self-aligned double patterning (SADP); JMP (statistical analysis software); ASML Yield Star; Overlay modeling, alignment, optics and focus control for semiconductor lithography; Defect Source Investigation; 6-Sigma FAB EHS (Environment, Health and Safety); or Photoresists. Experience may be gained while in graduate school. Please email resume to and reference Job .