Packaging and Mechanical Engineer Semiconductor Development

At Phoenix Semiconductor, we are pioneering a new approach to solving supply chain disruption due to late-gen, legacy, and mature microelectronic components. Our team is working to produce an extensive catalog of chips for the Department of Defense, automotive, medical, manufacturing, oil & gas, and OEM verticals. Headquartered in Austin, Texas our innovative process is challenging how companies solve obsolescence challenges.Legacy chips at scale, on demand and in perpetuity. Rethink whats possible

Job Summary:
Phoenix Semiconductor Corporation, a leading innovator in the semiconductor industry, is seeking a highly skilled and innovat ive Packaging and Mechanical Engineer t o join our semiconductor development team. This role focuses on the mechanical design, packaging, thermal management, and structural integrity of semiconductor devices and supporting systems. The ideal candidate will possess experience in precision engineering, microelectronic packaging, and materials science, with a keen eye for detail and quality.

In this role, your key responsibilities will be:

• Design & Development:
  • Develop mechanical designs for semiconductor components, including chip packaging, heat sinks, enclosures, and interconnect structures.
  • Perform thermal, structural, and vibration analysis using simulation tools.
  • Collaborate with electrical engineers to ensure mechanical designs meet electrical and thermal performance specifications.
  • Support R&D efforts of additive manufacturing as related to various aspects of electronic components Packaging, substrate printing, PCB printing, etc
• Materials & Manufacturing:
  • Select materials suitable for clean room environments, high-reliability applications, and harsh environments (e.g., high temp, radiation).
  • Provide guidance for component selection for use in hermetically sealed enclosures. Understand off-gassing and long-term reliability concerns and constraints.
  • Interface with vendors to evaluate DFM (Design for Manufacturability) for components such as PCBs, die carriers, and encapsulants.
• Testing & Validation:
  • Develop and execute test plans for thermal, mechanical shock, vibration, and environmental reliability.
  • Support failure analysis and root cause investigations.
• Project Management:
  • Maintain documentation including 3D models, drawings, BOMs, and manufacturing instructions.
  • Participate in cross-functional project reviews and provide input on product lifecycle decisions.

Basic Qualifications:

• US Citizen - Ability to get a DoD Clearance
• Bachelors or Masters degree in Mechanical Engineering or a related field.
• 3+ years of experience in semiconductor packaging, electronics cooling, or precision mechanical systems.
• Proficiency in CAD tools such as SolidWorks, Creo, or CATIA.
• Experience with FEA tools and thermal simulation packages.
• Familiarity with semiconductor fabrication processes, packaging standards, and materials.

Preferred Qualifications:

• Experience with clean room-compatible designs and materials.
• Knowledge of JEDEC and IPC packaging standards.
• Exposure to reliability testing such as HALT/HASS.
• Experience working in a startup or fast-paced R&D environment.

Attributes:

• Strong problem-solving skills and analytical mindset.
• Excellent communication and teamwork abilities.
• Attention to detail and a commitment to high-quality engineering practices.
• Ability to manage multiple priorities and adapt to evolving project requirements.

What We Offer

• Competitive salary and benefits package, including:
  • 3 weeks of paid time off
  • 8 observed holidays
  • Comprehensive insurance coverage
• Employee Stock Ownership Plan (ESOP)
• An opportunity to work on mission-critical semiconductor solutions impacting multiple industries and national security.
• A collaborative and innovative culture with diverse and engaging projects.

Join us at Phoenix Semiconductor Corporation and be part of a team shaping the future of semiconductor technology.

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