SMT Process Engineer

Position Overview:

We are seeking a skilled and proactive professional to oversee and optimize our Surface Mount Technology (SMT) operations. This role involves managing SMT production lines, ensuring quality standards, and driving continuous improvement initiatives in a dynamic electronics manufacturing environment.

Key Responsibilities:

• Oversee and facilitate training for machine operators to ensure consistent performance.


• Operate and program SMT machinery, including screen printers and pick-and-place systems, ensuring compliance with IPC-A-610 standards.


• Utilize inspection tools such as SPI, AOI, and x-ray systems to verify assembly quality.


• Conduct thorough root cause investigations for major defects and implement effective corrective and preventive measures.


• Create and maintain thermal profiles for reflow ovens to support both new product introductions and existing assemblies.


• Lead initiatives to enhance manufacturability using Six Sigma or similar methodologies.


• Collaborate with engineering teams to review product designs for manufacturability and assembly efficiency.


• Supervise assembly line activities, including product builds, functional testing, and final inspections.


• Establish and monitor process parameters for solder paste application, component placement, reflow, and inspection.


• Track and analyze process yields to ensure optimal throughput and capability.


• Investigate SMT-related defects and recommend actionable solutions.


• Oversee PCB inspection and functional testing processes.


• Develop and refine procedures for assembly and rework to support continuous improvement.

Qualifications:

• Bachelors degree in Engineering required; Masters degree preferred.


• At least 3 years of hands-on experience with SMT processes and equipment.


• Minimum of 5 years in electronics manufacturing.


• Proven experience conducting DFM reviews and resolving technical challenges.


• Strong understanding of SMT components, PCB assembly, and related equipment.


• Proficiency with AOI, ICT, FCT, and various soldering techniques (e.g., wave, reflow).


• Experience with MPM printers and Air Vac rework systems.


• Familiarity with IPC/J-STD-001 Class III standards.


• Demonstrated ability to debug and optimize manufacturing lines.


• Experience launching at least one full-scale electronics production line.

Physical & Travel Requirements:

• Must be able to lift up to 35 lbs and perform tasks that involve standing, sitting, bending, and reaching.


• Regular use of hands and frequent communication is required.


• Occasional travel, including overnight stays, may be necessary.


• Must be able to drive to client locations safely.