Process Engineer (Wet-Clean and Spin-Clean)

40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m. MINIMUM REQUIREMENTS: Must have a Masters degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or related field plus 4 years of experience; or a PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or related field plus 2 years of experience. Must have 1 year of experience with wet-clean and spin-clean semiconductor industry processes. Must have 2 years of experience on semiconductor equipment with surface preparation and analytical techniques. Must have 2 years of experience with statistical analysis and problem-solving methodologies. Must have 2 years of experience in at least 3 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR). Must have 2 years of experience in at least 3 of the following: wafer cross section techniques; wafer fabrication processes; nanomaterial fabrication; ion transport phenomena; dynamic random-access memory (DRAM); plasma etching; plasma simulation; semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash; Chemical Vapor Deposition (CVD); or Plasma Enhanced Chemical Vapor Deposition (PECVD). Must have 1 year of experience in 1 of the following software: Matlab; Labview; JMP; Minitab; Mathematica; or Origin. Experience may be gained while in graduate school. Please email resume to and reference Job .